Active Metal Copper Circuit (AMC) Substrate
It is possible to form circuits on high-strength silicon nitride substrates. It is recommended for inverters and power module substrates.
The product is an insulating circuit board that bonds a copper plate to a silicon nitride substrate through an active metal solder. Although its thermal conductivity is about half that of aluminum nitride substrates (90W/mK), it excels in mechanical strength, allowing for the creation of substrates at half the thickness, resulting in thermal resistance values comparable to aluminum nitride substrates, making it a viable alternative. Utilizing its excellent fracture toughness, the substrate can be directly screwed onto a heat sink or ultrasonic bonded directly to electrode terminals on a copper circuit board, enabling a variety of mounting structures compared to aluminum nitride substrates. **Features** - Thermal conductivity is about half that of aluminum nitride substrates (90W/mK) - Excellent mechanical strength allows for substrates to be made at half the thickness - Results in thermal resistance values comparable to aluminum nitride substrates, making it a viable alternative - Excellent fracture toughness allows for direct screwing onto heat sinks or ultrasonic bonding of electrode terminals directly onto copper circuit boards *For more details, please refer to the related links or feel free to contact us.*
- Company：東和電気
- Price：Other
